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HDI buried blind via plate

HDI buried blind via plate

As the carrier of electronic components, the number of layers in a multilayer board and the precision of the circuit design determine the size and performance of the circuit board. This industrial-grade robot uses an 8-layer board design with 3 mil / 3 mil line width and spacing, and simultaneously packages 10 sets of ICs and 12 sets of BGAs, making it a high-end product of high-precision printed circuit boards. Main process features: ① Buried and blind via design; ② 3 mil line width and spacing; ③ BGA ball design requires uniform size and consistency; ④ IC green solder mask bridge 4 mil / 4 mil Process characteristics: high-precision interconnection board Technical specifications: 3 mil / 3 mil line width/spacing Finished board thickness: 2.0±0.1mm Outer copper thickness: 35um Surface treatment: immersion nickel gold

Keywords: High-end productsandofthemil

5G High-Frequency High-Speed and Microwave Board

5G High-Frequency High-Speed and Microwave Board

The design of high-frequency microwave multilayer boards made by mixing high-frequency substrates with FR-4 has a higher density than low-frequency boards. Generally, high-frequency boards are used in circuits with frequencies above 1G. Its dielectric constant is critical; the DK value is very small and stable, dielectric loss is minimal, and it has excellent properties such as resistance to moisture absorption, heat resistance, and corrosion resistance.

Keywords: Communication Productstheofandmicrowave

Clapper talk, model opera

Clapper talk, model opera

1. The area is calculated based on the quantity of the current batch order; 2. The standard material is ordinary FR4 category; 3. The standard board thickness is 0.4mm-2.0mm; 4. The standard copper thickness is 12um-35um (converted to 1/3 OZ-1 OZ); 5. The standard copper thickness line width and spacing for regular boards are ≥0.1mm, and for HDI boards are ≥0.05mm; 6. Surface treatment types include OSP, immersion nickel-gold, OSP + immersion nickel-gold, lead-free hot air solder leveling, and leaded hot air solder leveling; 7. For special materials and special process delivery cycles, please consult customer service. 8. For delivery cycle requirements beyond the regular schedule, please consult customer service.

Keywords: Instrumentationdaysthestandardfor

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