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Keywords: High-end productshigh-endproducts

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High-end products

Keywords: High-end productshigh-endproducts

High-end products

High-end products

Keywords: High-end productshigh-endproducts

High-end products

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Special Circuit Board (Metal Base)

Special Circuit Board (Metal Base)

Type: Copper Substrate Category: PCB Manufacturing Thermal Conductivity: 1.0W/MK 1.2W/MK 1.5W/MK 2.0W/MK 2.4W/MK Surface Treatment: None Board Thickness: 1.5mm Outer Copper Thickness: 35um Type: Double-sided Copper Substrate Withstand Voltage: ≥4000 V TG: 170 Introduction: Aluminum substrates are mainly used in products with high thermal conductivity requirements, such as LED street lights and household energy-saving lamps. Copper substrates are mainly used in devices requiring fast heat dissipation and low expansion coefficients, such as military radars. Ceramic boards are mainly used in high-frequency base stations and automotive electronics.

Keywords: High-end productsmkcopperandin

HDI buried blind via plate

HDI buried blind via plate

As the carrier of electronic components, the number of layers in a multilayer board and the precision of the circuit design determine the size and performance of the circuit board. This industrial-grade robot uses an 8-layer board design with 3 mil / 3 mil line width and spacing, and simultaneously packages 10 sets of ICs and 12 sets of BGAs, making it a high-end product of high-precision printed circuit boards. Main process features: ① Buried and blind via design; ② 3 mil line width and spacing; ③ BGA ball design requires uniform size and consistency; ④ IC green solder mask bridge 4 mil / 4 mil Process characteristics: high-precision interconnection board Technical specifications: 3 mil / 3 mil line width/spacing Finished board thickness: 2.0±0.1mm Outer copper thickness: 35um Surface treatment: immersion nickel gold

Keywords: High-end productsandofthemil

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