Process Capability

Project	Technical Parameters	Special Process
Number of Layers	1-20	High Tg Fr4
Warping	≤0.075mm	D≤0.05mm
Characteristic Impedance Tolerance	±10%	±5%
Outline Tolerance	±0.1mm	±0.05mm
Surface Treatment Technology	Gold Fingers: ≥0.13μm	≥1.0μm
	ENIG: 0.03~0.05μm OSP: 0.2~0.5μm
	Hot Air Solder Leveling (HAL): 5~20μm; Lead-free HAL: 5~20μm
	Gold Plating: 0.025~0.075μm
Minimum Line Width and Spacing	Minimum Line Width 0.075mm / Minimum Line Spacing 0.075mm
Substrate	FR-4, Aluminum Base, Copper Base, Ceramic, FR1, CEM1, F4B, BT, etc.
Minimum Drill Hole Diameter	Mechanical Drilling 6mil (0.15mm) Laser Drilling 2.5mil (0.0635mm)
Maximum Processing Area	580×700mm
Copper Thickness in Hole Wall	≥20μm
Board Thickness	0.15mm-5.0mm
Forming Type	Milling Machine, Punching Machine, V-cut, Bevel Edge
Surface Coating	Solder Mask: Black, Green, White, Red, Thickness ≥17μm, Plugged Holes, BGA
	Text: Black, Yellow, Green, White, Font: Minimum Height 0.625mm, Minimum Line Width 0.125mm
	Carbon Film: Black, Thickness ≥25μm, Minimum Line Width 0.30mm, Minimum Line Spacing 0.30mm
	Blue Glue: Red, Blue, Thickness ≥300μm

Project	Sample	Mass Production	Project	Sample	Mass Production
Maximum Number of Layers	30	26	Impedance Control Accuracy	±5%Q	±8%Q
Minimum Line Width / Spacing	2.5/2.5mil	3/3mil	Hole Diameter Tolerance	PTH: ±0.075mm NPTH: ±0.05mm	PTH: ±0.075mm NPTH: ±0.05mm
Minimum Mechanical Hole Diameter	0.15mm	0.15mm	Minimum Hole Pad Diameter	Hole + 0.2mm	Hole + 0.3mm
Hole Spacing	0.2mm	0.4mm	Laser Drilled Board
Board Thickness to Hole Diameter Ratio	0.667361111	0.500694444	Minimum Laser Hole Diameter	0.1mm	0.1mm
Maximum Processing Board Size	570*760mm	570*760mm	Maximum Laser Depth	0.1mm	0.1mm
Maximum Board Thickness	7.0mm	6.0mm	Minimum Laser Depth	0.06mm	0.06mm
Minimum Board Thickness	0.4mm	0.4mm	HDI Stack-up	3+n+3	2+n+2
Minimum Inner Layer Board Thickness	0.05mm	0.05mm	Minimum Hole Pad Diameter	Hole + 0.15mm	Hole + 0.15mm
Base Material: FR-4 (Standard TG, Medium TG, High TG), Halogen-free, CT1600, M4 Grade, M6 Grade, M7 Grade, PTFE, Hydrocarbon Materials, etc. Surface Treatment Processes: Lead-free HAL, ENIG, Electrolytic Gold, OSP, Immersion Tin, Immersion Silver, etc. Special Processes: Mixed Lamination, Buried Resistor, Buried Copper Fast, Silver Paste (Copper Paste Plugged Holes), Back Drilling, Step Slot, etc.

Customer Service Hotline

+86-0712-4788996

E-MAIL:yinyaoming@ltepcb.com
Address: Longteng Industrial Park, Xiaochang Economic Development Zone, Xiaogan City, Hubei Province

QR Code

This website supports dual access via IPV4 / IPV6

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

COOKIES

required

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

analyze

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

Feature

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

advertise

These cookies help us understand what you are interested in so that we can show you relevant advertising on other websites. Turning these cookies off will mean we are unable to show you any personalized advertising.

WhatsApp：8607124788996

E-mail：yinyaoming@ltepcb.com

Tel：+86-0712-4788996