HDI Buried Blind Via Board
Summary：A national high-tech enterprise specializing in R&D, production and sales of printed circuit boards. The company has become one of the leading printed circuit board manufacturers in China with its strong manufacturing capacity, modern management system and one-stop, multi-variety business characteristics.
Key words：Circuit boards, high-precision multilayer boards, metal substrates
As the carrier of electronic components, the number of layers of the multi-layer board and the precision design of the circuit determine the size and performance of the circuit board. This industrial-grade robot adopts an 8-layer board design, with a line width of 3 m i l / 3 m i l between lines. It is a high-end product of high-precision printed circuit boards with 10 sets of ICs and 12 sets of BGAs packaged at the same time.
Main process characteristics
① Buried blind via design;
② 3mil line width and line spacing;
③ BGA spherical design needs to be equal in size;
④ IC green oil bridge 4mil/4mil
Process features: high-precision interconnection board
Specifications: 3mil/3mil line width/line spacing
Finished plate thickness: 2.0±0.1mm
Outer copper thickness: 35um
Surface treatment: Immersion nickel gold