Service philosophy

Process Capability

Project	Technical parameter	Special Process
Project	Technical parameter	Special Process
layers	1-20	High Tg Fr4
Warpage	Double Side multi-layers d≤0.075mm d≤1%	D≤0.05mm
Characteristic impedance error	±10%	±5%
Appearance Tolerance	±0.1mm	±0.05mm
Surface treatment technology	Gold finger: ≥0.13μm	≥1.0μm
	Immersion Gold: 0.03~0.05μm OSP: 0.2~0.5μm
	Spray tin (HAL): 5~20μm; lead-free spray tin: 5~20μm
	Gold plating: 0.025~0.075μm
Minimum line width and line spacing	Minimum line width 0.075mm minimum line 0.075mm
Substrate	FR-4, aluminum base, copper base, ceramic, FR1, CEM1, F4B, BT, etc.
Minimum hole diameter	Mechanical drilling 6mil (0.15mm) Laser drilling 2.5mil (0.0635mm)
Maximum processing area	580×700mm
Hole wall copper thickness	≥20μm
Plate thickness	0.15mm-5.0mm
Molding type	Milling machine, punching machine, V-cut, bevelling
Surface coating	Solder mask: black, green, white, red, thickness ≥17μm, plug hole, BGA
	Text: black, yellow, green, white, font: minimum character height 0.625mm, minimum line width 0.125mm
	Carbon film: black, thickness≥25μm, minimum line width 0.30mm, minimum line spacing 0.30mm
	Basket glue: red, blue, thickness≥300μm

Project	Sample	Mass production	Project	Sample	Mass production
The highest number of floors	30	26	Impedance Control Accuracy	±5%Q	±8%Q
Minimum line width/ line spacing	2.5/2.5mil	3/3mil	Bore Tolerance	PTH:±0.075mm NPTH:±0.05mm	PTH:±0.075mm NPTH:±0.05mm
Minimum Mechanical Bore	0.15mm	0.15mm	Minimum hole pad diameter	孔+0.2mm	孔+0.3mm
Hole spacing	0.2mm	0.4mm	Laser Drilled Plate
Plate Thickness: Aperture Ratio	0.667361111	0.500694444	Minimum laser aperture	0.1mm	0.1mm
Maximum processing board size	570*760mm	570*760mm	Maximum laser depth	0.1mm	0.1mm
Maximum plate thickness	7.0mm	6.0mm	Minimum laser depth	0.06mm	0.06mm
Minimum plate thickness	0.4mm	0.4mm	HDI stack	3+n+3	2+n+2
Minimum inner layer thickness	0.05mm	0.05mm	Minimum Aperture Pad Diameter	Hole+0.25mm	孔+0.3mm
Substrate: FR-4 (ordinary TG, medium TG, high TG), halogen-free, CT1600, M4 grade, M6 grade, M7 grade, PTFE, hydrocarbon materials, etc. Surface treatment process: lead-free spray tin, immersion gold, electric gold, OSP, immersion tin, immersion silver, etc. Special process: mixed pressure, buried resistance, buried copper fast, silver paste (copper paste plug hole), back drilling, stepped groove, etc.